Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.

#include "ns3/csma-net-device.h" #include "ns3/inet-socket-address.h" #include "ns3/internet-stack-helper.h" #include "ns3/ipv4-address-helper.h" #include "ns3/ipv4 ...

This project presents a simulation-based LiFi (Light Fidelity) communication system that models data transmission using light signals and evaluates system performance under varying environmental ...