TAIPEI, March 4, 2026 /PRNewswire/ -- NEXCOM, a leading provider of mission-critical network platforms, and Hytec Inter, Japan's 5G wireless communication expert, today announced at MWC Barcelona 2026 ...

The collaboration brings together NEXCOM’s ISA 141 dual 5G onboard user equipment with Hytec Inter’s private 5G solution, enabling seamless handover between networks through Dual SIM Dual Active (DSDA ...

AMD has expanded its Socket AM5 desktop lineup with the Ryzen AI 400G series, based on the 4 nm “Gorgon Point” APU silicon. This marks AMD’s second desktop APU generation for AM5 after the Ryzen 8000G ...

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