AI power prediction; large-area FPCBs; graphene vibrations.

Semiconductor engineering teams have long relied on an iterative simulation workflow: define the scenario, prepare the model, ...

A new technical paper, “Nonvolatile photonic field-programmable coupler array,” was published by researchers at University of ...

Key Takeaways Architectural conformance and implementation verification are necessary but different for RISC-V designs, yet few verification engineers have experience on the conformance side. While ...

Inferencing at the edge has very different needs than training large language models or large-scale inferencing in AI data centers. Many edge devices run on a battery. They're price-sensitive, and ...

New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...

Key Takeaways Assisted and autonomous driving require more data from more sensors, and much faster processing of some of that data. The shift to software-defined vehicles and centralized intelligence ...

Google's TPUs now for sale; 2/3nm capacity crunch; IC tool sales to China stopped; memory shortage widens in 2027; ...

The complexity problem The most direct explanation for why materials misbehave in production is also the most uncomfortable ...

A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...

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A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...