AI power prediction; large-area FPCBs; graphene vibrations.

Semiconductor engineering teams have long relied on an iterative simulation workflow: define the scenario, prepare the model, ...

A new technical paper, “Nonvolatile photonic field-programmable coupler array,” was published by researchers at University of ...

Key Takeaways Architectural conformance and implementation verification are necessary but different for RISC-V designs, yet few verification engineers have experience on the conformance side. While ...

Inferencing at the edge has very different needs than training large language models or large-scale inferencing in AI data centers. Many edge devices run on a battery. They're price-sensitive, and ...

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New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...

Google's TPUs now for sale; 2/3nm capacity crunch; IC tool sales to China stopped; memory shortage widens in 2027; ...

Key Takeaways Assisted and autonomous driving require more data from more sensors, and much faster processing of some of that data. The shift to software-defined vehicles and centralized intelligence ...

The complexity problem The most direct explanation for why materials misbehave in production is also the most uncomfortable ...

A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...

TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U ...