Google's TPUs now for sale; 2/3nm capacity crunch; IC tool sales to China stopped; memory shortage widens in 2027; ...

TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U ...

The complexity problem The most direct explanation for why materials misbehave in production is also the most uncomfortable ...

New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...

A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...

Key Takeaways Architectural conformance and implementation verification are necessary but different for RISC-V designs, yet few verification engineers have experience on the conformance side. While ...

Inferencing at the edge has very different needs than training large language models or large-scale inferencing in AI data centers. Many edge devices run on a battery. They're price-sensitive, and ...

If you’re working on SoCs at 2 nm or below, you know DRC is a different beast these days. Early in the design, it’s common ...

A new technical paper, “Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced ...

Key Takeaways Assisted and autonomous driving require more data from more sensors, and much faster processing of some of that data. The shift to software-defined vehicles and centralized intelligence ...

A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...

A Fault-Tolerant Compiler for Chiplet Quantum Architectures,” was published by researchers at the Technical University of ...