Design of experiments (DoE) is an efficient method for planning experiments. DoE involves intentionally changing one or more input-process factors – also known as independent variables – to observe ...

Component sales sentiment remained strong in April, declining 2.6 points overall to 146.6, as growth expectations for passives were offset by a slower outlook for other parts. The outlook for passive ...

Stackpole Electronics has expanded its HCC series of high-current bus bar shunt resistors with additional sizes and configurations to support growing demand in battery-powered systems. TDesigned for ...

IPC-2581 v4.0 advances digital data exchange by embedding design intent, reducing handoff errors. Momentum around IPC-2581 is ...

Agentic AI, properly implemented, offers a path forward. But it will not emerge from larger models or more data alone. It requires a deliberate effort to capture and formalize design intent, to encode ...

The plating type is usually immaterial to the footprint geometry but is often incorporated somewhere in the vendor part ...

Growing use of AI in design and inspection workflows introduces internal security risks, as improper tools may expose sensitive data and compromise compliance. Security has become a major issue for ...

While the US may be able to satisfy defense-sector demand for high-performance RF semiconductor needs, as the Chips Act has ...

How design reuse and IP management drive engineering excellence. In today’s electronics industry, product complexity ...

ARAYA, THAILAND – Doosan is investing approximately $135 million to establish a new production base for copper clad laminates (CCL), a key material used in printed circuit boards, as global AI ...

Lean Six Sigma gives employees the tools and training to optimize the production process. To better understand the difference: Lean Six Sigma = capable and effective. A key element in training is to ...

FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and ...