Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, ...

SINGAPORE, March 24, 2026 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. ("K&S", "Company") today announced an expanded portfolio of memory–focused interconnect solutions, reinforcing its ...